Laser cutting
US10195690B2 · kind B2 · utility
70Cited by
11References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 25, 2016 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Nov 3, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45041
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.