Chemical mechanical polishing machine and polishing head assembly
US10195715B2 · kind B2 · utility
0Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2016 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Apr 3, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing machine includes a polishing head assembly including a polishing head body and a membrane disposed at a bottom of the polishing head body. The bottom surface of the membrane includes a hydrophobic area and a hydrophilic area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.