Gypsum board manufacturing method and manufacturing device
US10195765B2 · kind B2 · utility
1Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2014 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Apr 21, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28B19/0092
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
As a lower forming plate 8, a forming plate having: a lower plate main body 10 constituted from an electrically conductive material; and a lower embedded electrode 12 embedded in the lower plate main body 10, the lower embedded electrode 12 being electrically insulated from the lower plate main body 10 by an insulator 14 and being embedded so as for a portion thereof to be exposed on the surface of the lower plate main body 10 making contact with a lower lining paper sheet 16 is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.