Liquid ejecting head chip, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of liquid ejecting head chip
US10195849B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2018 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Mar 19, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/22
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Channel grooves for a discharge channel and a non-discharge channel are formed in the surface of an actuator plate by cutting. The discharge channel includes an extension portion and a raise-and-cut portion, and the non-discharge channel also includes an extension portion and a raise-and-cut portion. In an embodiment, an electrode clearance groove is formed in advance by cutting with a dicing blade or the like. After the electrode clearance groove is formed, an electrode is formed by plating. Since plating is performed after the electrode clearance groove is formed, a clearance groove electrode is integrally formed with an AP-side common pad in the electrode clearance groove, and thus the clearance groove electrode and the AP-side common pad are short-circuited. Thus, an electrode separation portion is formed by cutting a short-circuited portion of the clearance groove electrode and the AP-side common pad through cutting or irradiation with laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.