Frit material, photoelectric packaged device and packaging method thereof, and display apparatus
US10196300B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 29, 2016 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Jan 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Examples of the present invention provide a frit material, a photoelectric packaged device and a packaging method thereof, and a display apparatus. They relates to the field of display technology, and may reduce the bubbles generated during the sintering of the frit material at high temperature, improve the flatness of the surface of the frit material, and increase the proportion of the packaged area after the frit material is adhered to the device substrate, to increase the mechanical strength of the packaged OLED panel, while the viscosity of the frit material is not affected. The frit material comprises frit-powders and an organic material comprising an organic thickener, wherein the frit material further comprises an inorganic thickener consisting of a clay mineral material. Examples of the present invention are used for production of the frit material, the photoelectric packaged device comprising the frit material, and the display apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.