Mask assembly for thin film deposition that includes a partially etched area and method of manufacturing the mask assembly
US10196732B2 · kind B2 · utility
6Cited by
1References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 14, 2015 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Nov 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/166
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A mask assembly for thin film deposition, the mask assembly, including a mask frame having an opening; a mask coupled to the mask frame and having a first surface facing a substrate and a second surface opposite to the first surface, a plurality of deposition pattern portions, and a rib between the adjacent deposition pattern portions, the mask having a partially etched area, the plurality of deposition pattern portions being within the partially etched area; and a partial etching extension portion in an outer portion of an area corresponding to the plurality of deposition pattern portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.