Surface treatment of metal substrates
US10196744B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 25, 2015 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Sep 25, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC10N2050/023
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A process for surface treatment of metal substrates, including the steps of: providing a metal substrate including hydroxyl groups at its surface; bringing the metal substrate into contact with a solution of at least one organophosphorus compound to enable the reaction of the hydroxyl groups at the surface of the metal substrate with the organophosphorus compound to form a monomolecular layer over the surface and a second layer of physisorbed organophosphorus molecules at least preponderantly crystallized, the obtained treated substrate being coated with the organophosphorus compound in the form of a first monomolecular layer coating at least 15% of the surface of the substrate and in the form of a physisorbed second layer at least preponderantly crystallized. A treated metal substrate which may be obtained by the process thereof, corresponding solution and its use for treating metallic substrates to improve their tribological properties during their shaping, in particular their stamping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.