Testing device
US10197621B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2014 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | May 31, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/5602
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A testing device includes a system circuit board, a first chip component, a supporting structure, a circuit board and an interposer. The system circuit board has a surface where the first chip component is disposed. The first chip component is connected to the system circuit board. The supporting structure is disposed on the surface and surrounds the first chip component; the circuit board is fixed on the supporting structure and keeps distance from the first chip component. The circuit board has a connector for connecting to a chip component that is to be tested. The interposer is located between the circuit board and the first chip component. The circuit board is connected to the first chip component via the interposer. The first chip component need not connect to the chip component to be tested, so is less liable to be damaged by the frequent testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.