Edge coupling device fabrication
US10197733B2 · kind B2 · utility
5Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2017 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Apr 19, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12195
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An edge coupling device including a substrate, a buried oxide disposed over the substrate, a cladding material disposed over the buried oxide, where the cladding material includes a trench, an inversely tapered silicon waveguide disposed within the cladding material beneath the trench, and a ridge waveguide disposed within the trench, where the ridge waveguide and the inversely tapered silicon waveguide are vertically-aligned with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.