Photosensitive resin composition and cured product thereof
US10197913B2 · kind B2 · utility
1Cited by
1References
7Claims
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Key dates
| Filing date | Sep 29, 2015 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Sep 29, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/38
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is a photosensitive resin composition that contains (A) a photobase generator and (B) an alkali-soluble epoxy compound, wherein the photobase generator (A) contains a compound represented by formula (2-1): and the alkali-soluble epoxy compound (B) is an epoxy compound obtained by reacting (c) a polybasic acid anhydride with a product of a reaction between (a) an epoxy compound having two or more epoxy groups in the molecule and (b) a compound having one or more hydroxyl groups and one carboxyl group in the molecule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.