Electronic component package and method of manufacturing the same
US10199337B2 · kind B2 · utility
5Cited by
7References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2016 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | May 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component package and a method of manufacturing the same are provided. The electronic component package includes a frame having a through-hole, an electronic component disposed in the through-hole of the frame, and a redistribution part disposed at one side of the frame and the electronic component. One or more first wiring layers of the frame are electrically connected to the electronic component through the redistribution part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.