Semiconductor module
US10199365B2 · kind B2 · utility
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20Claims
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Assignee
Inventors
Key dates
| Filing date | Feb 2, 2018 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Feb 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a semiconductor module includes a first circuit component, a first connection member, and a first wire. The first circuit component includes a first substrate, a first conductive layer, a first switching device, and a first diode. The first substrate has an insulation property. The first connection member is provided on a first electrode of the first switching device and the fourth electrode of the first diode, and has a conductive property. The first wire connects the first conductive layer and the first connection member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.