Electrical connection structure, array substrate and display device
US10199397B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 22, 2015 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | May 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/05
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An electrical connection structure, an array substrate and a display device. The electrical connection structure includes a first electrical connection component, which includes: a conductive structure; an insulating layer covering the conductive structure, where at least one first via hole and at least one second via hole are disposed separately in the insulating layer, each first via hole and each second via hole expose a respective part of a surface of the conductive structure; and a conductive connection layer disposed on the insulating layer and covering the at least one first via hole and the at least one second via hole, where the conductive connection layer and the conductive structure are electrically connected with each other through the at least one first via hole and the at least one second via hole. The electrical connection structure can reduce undercut phenomena that occur at via holes in the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.