Optoelectronic modules including an image sensor having regions optically separated from one another
US10199412B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2015 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Jul 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.