Methods of manufacturing a color image sensor having an array of pixels with color filters

US10199413B2 · kind B2 · utility

Assignees

• STMicroelectronics SA
• STMicroelectronics (Crolles 2) SAS · FR

Inventors

• Axel Crocherie · Grenoble, FR
• Jean-Pierre Oddou · Grenoble, FR
• Stephane Allegret-Maret · Grenoble, FR
• Hugues Leininger · Crolles, FR

Key dates

• Filing date: Dec 12, 2017
• Grant date: Feb 5, 2019
• Expiry date: Jan 18, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/811

Abstract

A color image sensor including an array of pixels is formed in a semiconductor layer having a back side that receives an illumination. Insulated conductive walls penetrate into the semiconductor layer from the back side and separate the pixels from one another. For each pixel, a color pixel penetrates into from 5 to 30% of a thickness of the semiconductor layer from the back side and occupies at least 90% of the surface area delimited by the walls. An electrically-conductive layer extends from the lateral wall of the filter all the way to the walls.