Semiconductor device and manufacturing method, and electronic appliance
US10199419B2 · kind B2 · utility
2Cited by
0References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2016 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Feb 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a semiconductor device including: a plurality of bumps (13) on a first semiconductor substrate (11); and a lens material (57) in a region other than the plurality of bumps on the first semiconductor substrate, wherein a distance between a side of a bump closest to the lens material and a side of the lens material closest to the bump is greater than twice a diameter of the bump closest to the lens material, and wherein the distance between the side of the bump closest to the lens material and the side of the lens material closest to the bump is greater a minimum pitch of the bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.