Micro-transfer-printed acoustic wave filter device
US10200013B2 · kind B2 · utility
224Cited by
97References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2016 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Jun 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/0019
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.