EMI shielding structure and manufacturing method thereof
US10201072B2 · kind B2 · utility
6Cited by
28References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2017 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Apr 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1344
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.