Systems for encapsulating a hybrid assembly of electronic components and associated methods
US10201094B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2014 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Apr 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.