Polymers containing benzimidazole moieties as levelers
US10201097B2 · kind B2 · utility
1Cited by
7References
3Claims
0Family size
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Key dates
| Filing date | Nov 20, 2013 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Jul 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Polymers of reaction products of dihalogens and compounds containing benzimidazole moieties are included in metal electroplating compositions to provide level metal deposits on substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.