Method for manufacturing modular microfluidic paper chips using inkjet printing
US10201811B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2013 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Feb 4, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention relates to a method for manufacturing a module type microfluidic chip comprising: (a) printing electrode patterns on a substrate using a conductive ink and inkjet printing; (b) cutting the printed electrode patterns; and (c) assembling the cut electrode patterns to manufacture the module type microfluidic paper chip. Unlike the traditional method for manufacturing printed circuit substrate using a patterning agent or device, the method of the present invention only incorporates a simple printing process using an inkjet printer, and thus patterning can be simplified and various types of chips can be manufactured depending on the assembly type of electrode patterns. Accordingly, inexpensive, economical, and highly utilizable microfluidic chips can be provided using the method of the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.