Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device

US10201866B2 · kind B2 · utility

Assignee

• SEHO SYSTEMTECHNIK GMBH · DE

Inventors

• Bernd Dreikorn · Wertheim, DE
• Thomas Herz · Kreuzwertheim, DE
• Reiner Zoch · Radeberg, DE
• Markus Walter · Wertheim, DE

Key dates

• Filing date: Dec 5, 2013
• Grant date: Feb 12, 2019
• Expiry date: Dec 5, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1509
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A soldering apparatus for selective soldering, comprising