Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole
US10201867B2 · kind B2 · utility
1Cited by
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14Claims
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Key dates
| Filing date | Dec 10, 2015 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Dec 10, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan θ (1), and0.16≤sin θ≤0.22 (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.