Patent · US Active

Heat-sensitive recording material for offset printing

US10202016B2 · kind B2 · utility

1Cited by

3References

18Claims

0Family size

Assignee

MITSUBISHI HITEC PAPER EUROPE GMBH · DE

Inventors

Gerhard Stork · Flensburg, DE
Nora Wilke · Flensburg, DE

Key dates

Filing date	Jan 29, 2015
Grant date	Feb 12, 2019
Priority date	—
Expiry date	Jan 29, 2035

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB41M2205/04
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

A heat-sensitive recording material suitable for offset printing, having a web-shaped substrate, having a front side and a reverse side opposite the front side, a heat-sensitive recording layer disposed at least on one of the two sides of the web-shaped substrate having at least one dye precursor and at least one (color) developer reactive with the dye precursor. The heat-sensitive recording layer has particles including an organic surface whose extent in the direction of the thickness of web-shaped substrate and heat-sensitive recording layer is greater than the thickness of the heat-sensitive recording layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.