Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same
US10202525B2 · kind B2 · utility
7Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2014 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Dec 23, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2883
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.