Optical proximity sensor and manufacturing method thereof
US10203398B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 29, 2018 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Jan 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1433
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A complex optical proximity sensor includes a substrate, a light emitter coupled to the substrate, an application-specific integrated circuit chip coupled to the substrate, a proximity sensor embedded in the application-specific integrated circuit chip, a barrier disposed between the application-specific integrated circuit chip and the light emitter, and an ambient light detection chip manufactured in advance and then coupled to the application-specific integrated circuit chip thereon with a pre-determined height. The elements are disposed within a limited area of an aperture and, with a manufacturing method of the complex optical proximity sensor, the detection angle of the ambient light is thereby maximized and the detection angle of the proximity sensor is thereby minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.