Resistor element and method of manufacturing the same
US10204721B2 · kind B2 · utility
0Cited by
5References
13Claims
0Family size
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Key dates
| Filing date | Nov 11, 2015 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Jan 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/06
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.