Manufacture method of polysilicon thin film and polysilicon TFT structure
US10204787B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2015 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Aug 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/0229
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a manufacture method of a polysilicon thin film and a polysilicon TFT structure. The manufacture method of the polysilicon thin film comprises: step 1, providing a substrate (1), and forming the polysilicon thin film (3) on the substrate (1), and a thickness of the polysilicon thin film (3) accords with a required thickness of manufacturing a semiconductor element; step 2, implementing silicon self-ion implantation to the polysilicon thin film (3), and an implantation volume of silicon ion is lower than a measurement limit for making polysilicon be decrystallized. The manufacture method of the polysilicon thin film makes the implanted silicon ion to form interstitial silicon to move to the polysilicon grain boundary, which can reduce the defect concentration of the polysilicon grain boundary and improve the quality of the polysilicon thin film. The present invention provides a polysilicon TFT structure, of which the island shaped semiconductor layer is manufactured by the polysilicon thin film after low volume silicon self-ion implantation, which can reduce the grain boundary potential barrier in the activation stage, and enlarge the carrier mobility,…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.