Wafer de-bonding device
US10204813B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2015 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Jul 16, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1967
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer de-bonding device comprises a stage (1) for holding a device wafer and a carrier wafer bonded together, and a tool (2) with a gas outlet (2.2) disposed in proximity to the stage (1) through an adjustment device for control the tool (2) to move towards or away from the stage (1), the tool (2) being provided with a bit (2.1) to cut a notch into a film or an adhesive layer at a junction of the bonded wafers, the gas outlet (2.2) being provided on the tool bit (2.1), the tool (2) being further provided with a gas inlet (2.3) in communication with the gas outlet (2.2), the gas inlet (2.3) being connected to a gas jet generator so as to direct a gas jet towards the junction of the bonded wafers on the stage (2). The wafer de-bonding device has a high degree of automation and simple operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.