Circuit board for mounting of semiconductor light emitting device and semiconductor light emitting device package using the same
US10205074B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 9, 2016 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Sep 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
Abstract
A semiconductor light emitting device package includes a semiconductor light emitting device including a plurality of electrodes, a circuit board including a mounting region, the semiconductor light emitting device being positioned on the mounting region of the circuit board, and a plurality of electrode pads on the circuit board, the plurality of electrode pads being electrically connected to the plurality of electrodes, wherein each of the plurality of electrode pads includes a first region and a second region, the first region overlapping the mounting region, and the second region excluding the first region, and wherein the plurality of electrode pads is arranged in a shape of rotational symmetry around a pivot point of the mounting region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.