Organic semiconductor thin film production method
US10205094B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2014 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Apr 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/655
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A raw material solution (6), in which an organic semiconductor material is dissolved in a solvent, is supplied to a substrate (1). The solvent is evaporated so that crystals of the organic semiconductor material are precipitated. Thus, an organic semiconductor thin film (7) is formed on the substrate (1). An edge forming member (2) having a contact face (2a) on one side is used and located opposite the substrate (1) so that the plane of the contact face (2a) intersects the surface of the substrate (1) at a predetermined angle. The raw material solution (6) is supplied to the substrate (1) and formed into a droplet (6a) that comes into contact with the contact face (2a). The substrate (1) and the edge forming member (2) are moved relative to each other in a direction parallel to the surface of the substrate (1) so as to separate the edge forming member (2) from the droplet (6a), and while the raw material solution (6) is supplied so that a change in size of the droplet (6a) with the relative movement is maintained within a predetermined range, the solvent contained in the droplet (6a) is evaporated to form the organic semiconductor thin film (7) on the substrate (1) after the contac…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.