Laser packaging method and manufacturing method of display panel
US10205119B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Nov 12, 2014 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Nov 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/851
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A laser packaging method and a manufacturing method of a display panel are provided. The laser packaging method includes placing a first substrate (2) on a platform (1), and arranging a glass frit in a packaging region of the first substrate (2); cell-assembling a second substrate (3) and the first substrate (2); and pre-heating the first substrate (2) and the second substrate (3) which are cell-assembled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.