Thermal insulation waveguide and wireless communication device
US10205211B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2016 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | May 26, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01S7/03
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal insulation waveguide between a high-temperature unit and a low-temperature unit in a vacuum, chamber of an embodiment, the thermal insulation waveguide includes, a first substrate including a first line in the high-temperature unit, a second substrate including a second line in the low temperature unit, and a thermal insulation element connecting the substrates, and including a third line including an inductance component and connecting the first and second lines. The first substrate includes a first capacitor unit connected with the first line. The second substrate includes a second capacitor unit connected with the second line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.