Compliant shield for very high speed, high density electrical interconnection
US10205286B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2017 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Oct 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6474
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.