Image pickup device with land layout that enables reliable soldering, and mounting board therefor
US10205857B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2017 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Jul 14, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/008
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image pickup device which ensures reliability of soldering without reinforcement using any additional special members or fixing with an adhesive agent or the like. The image pickup device outputs an image signal corresponding to an optical image. Signal terminals are placed on one surface of the image pick device and soldered to a mounting board on which the image pickup device is to be mounted. Reinforcing terminals provided on the one surface, on which the signal terminal is placed, reinforce the image pickup device. A holding fixing unit holds the image pickup device on the mounting board. When the image pickup device is mounted on the mounting board, the reinforcing terminals are located between the signal terminals and the holding fixing unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.