Method of assembling vehicular camera using molded interconnect device technology
US10205858B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2018 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Apr 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/54
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of assembling a vehicular camera includes providing a front housing and a rear housing and accommodating a lens assembly at the front housing. The rear housing includes first structure and second structure at an interior portion thereof. The rear housing includes electrically connecting elements established at and between the first structure and the second structure via molded interconnect device (MID) technology. A first printed circuit board has first circuitry that electrically connects to electrical contacts at the first structure. A second printed circuit board has second circuitry that includes an imager and that is in electrical connection with the electrical contacts at the second structure. An electrical connector at the rear housing electrically connects to circuitry of at least one of the first and second printed circuit boards. The front housing is mated with the rear housing to house the first and second printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.