Printed circuit board
US10206274B2 · kind B2 · utility
0Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2016 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Aug 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ground conductor film is formed at an insulating substrate. A floating conductor film capacitively couples to the ground conductor film. A radiating element is connected to the floating conductor film. A shielding film shields an electromagnetic wave radiated from the radiating element. By applying such a configuration to a printed circuit board, noise reduction can be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.