Embedding into printed circuit board with drilling
US10206286B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2017 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Jun 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one example, a method includes drilling a cavity into each contact pad of one or more contact pads of a first printed circuit board to form one or more cavities. The first printed circuit board includes an embedded integrated circuit and one or more metal layers. The method further includes forming one or more first metal layers for a second printed circuit board below a bottom surface of the first printed circuit board. The method further includes forming an electrically conductive material in the one or more cavities. The electrically conductive material electrically couples the one or more contact pads of the first printed circuit board to the second printed circuit board. The method further includes forming one or more second metal layers for the second printed circuit board above a top surface of the first printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.