Method for manufacturing circuit board and circuit board
US10206287B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2014 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Jan 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0502
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.