Meshed architecture rackmount storage assembly
US10206297B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2016 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Sep 9, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2213/0026
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems, methods, apparatuses, and software for data systems are provided herein. In one example, a meshed computing architecture is presented that includes a midplane comprising PCIe interconnect, storage modules configured to couple to a first portion of the PCIe interconnect, controller modules configured to couple to a second portion of the PCIe interconnect, and fabric modules configured to couple to a third portion of the PCIe interconnect. The first portion of the PCIe interconnect communicatively couples each of the storage modules to each of the controller modules and each of the fabric modules, the second portion of the PCIe interconnect communicatively couples each of the controller modules to each of the fabric modules, and third portion of the PCIe interconnect communicatively couples the controller modules to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.