Method of manufacturing a plurality of through-holes in a layer of first material
US10207244B2 · kind B2 · utility
0Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 27, 2017 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Feb 27, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0198
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of manufacturing a plurality of through-holes in a layer of first material by subjecting part of the layer of said first material to ion beam milling.For batch-wise production, the method comprises
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.