Patent · US Active

Laser reseal including optimized intensity distribution

US10207366B2 · kind B2 · utility

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10Claims

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Assignee

Robert Bosch GmbH · DE

Inventors

Alexander Ilin · Ludwigsburg, DE
Jochen Reinmuth · Reutlingen, DE
Mawuli Ametowobla · Stuttgart, DE
Philip Kappe · Stuttgart, DE

Key dates

Filing date	Dec 5, 2016
Grant date	Feb 19, 2019
Priority date	—
Expiry date	Sep 28, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/54
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method is described for manufacturing a micromechanical component including a substrate and a cap connected to the substrate, the cap, together with the substrate, enclosing a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity. An access opening connecting the first cavity to surroundings of the micromechanical component is formed in the substrate or in the cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or of the cap with the aid of a laser. The introduction of the energy or heat is controlled with the aid of a laser beam, which includes a spatial laser pulse expansion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.