Method of laser processing a component within an assembled apparatus using a boroscope
US10207367B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2017 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Jul 20, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/101
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of laser processing a component within an assembled apparatus using a boroscope, which includes a working head having first and second ends. A first optical fiber extends through the boroscope to a position between the first and second ends. A second optical fiber extends through the boroscope to the second end. A laser optical fiber extends through the boroscope. At least one lens is arranged between the first and second ends of the working head and a mirror is gimballed to the second end. The laser optical fiber directs laser light transmitted through the laser optical fiber onto the lens and then onto the mirror. A first LED is arranged at a position between the first and second ends of the working head and a second LED is arranged at the second end and an actuator device adjust the position of the mirror.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.