Device for machining a planar workpiece
US10207377B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2015 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Nov 6, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23Q2240/002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a device for machining a planar workpiece, having a machine stand which has a support surface (application surface) for a planar workpiece, and further having a machining head which can be moved relative to the support surface, which machining head has a tool for machining the workpiece and also has a holding unit (“hold-down unit”) with a pressure plate whereby the workpiece is pressed against the supporting surface; characterized in that the pressure plate has a structure which is comprised of a plurality of pieces, preferably two pieces, wherein at least one of the pressure plate parts is movable back and forth relative to at least one other pressure plate part, namely it is movable between the application position, in which the pressure plate part presses the workpiece against the application surface when the workpiece is applied to said application surface, and a released position, in which the pressure plate piece is at a minimum distance away from the workpiece when the workpiece is applied to said application surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.