In-mold apparatus and method for decorative application
US10207434B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2016 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Apr 15, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3076
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus includes a matched die mold including a male die mold and a female die mold wherein the male die mold includes a first contoured surface and the female die mold includes a second contoured surface. The apparatus further includes a frame which defines an opening wherein the frame is positioned between the male die mold and the female die mold such that the frame is adapted to position a film layer across the opening and the opening is positioned in alignment with at least one of the first contoured surface and the second contoured surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.