Method of producing polyimide resin, method of producing polyimide coating, method of producing polyamic acid solution, polyimide coating, and polyamic acid solution
US10208163B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2015 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Aug 7, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L79/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method of producing a polyimide resin that produces a polyimide resin having excellent heat resistance and mechanical properties, and having a low dielectric constant even when heat-treated at a lower temperature. The method includes heating at 120° C. to 350° C. a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in a solvent including at least a compound represented by the general formula (1), in which R1 represents a hydrogen atom or a hydroxyl group, R2 and R3 independently represent a hydrogen atom or a C1 to C3 alkyl group, and R4 and R5 independently represent a C1 to C3 alkyl group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.