Systems and methods for coupling a metal core PCB to a heat sink
US10208940B2 · kind B2 · utility
3Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2017 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Aug 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0061
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.