UV LED systems and methods
US10209005B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2016 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Jul 28, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D3/067
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Ultra violet light-emitting diode (hereafter UV LED) curing units containing one or X array or XY arrays of UV LED modules with integrated optical, mechanical, and heat dissipation systems, and one, or X array, or XY arrays of extrusions with integrated air or liquid cooling systems to receive and house the integrated UV LED. The UV LED modules may be any size or shape depending on the power requirements of a given curing application. The LED chips or the groups of LED chips used for the above UV LED modules may be in other wavelengths for other applications. The UV LED modules have excellent heat dissipation because the LED chips or groups of LED chips are directly mounted on metal extrusion. The LED modules also have a single optical lens system between the LED chips and the surrounding ambient air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.