Photonic chip with reflecting structure for folded optical path
US10209442B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2018 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | May 14, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12142
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Optical coupling of a photonic chip to an external device by use of a system with two lenses. The photonic chip comprises a light guide layer supported by a substrate and covered by an encapsulation layer, and a lens integrated into either the front face or the back face. The light guide layer includes a wave guide coupled to a surface grating coupler. An arrangement of one or several reflecting structures each on either the front face or the back face, is provided. This arrangement comprises a reflecting structure on the back face and is made so as to assure propagation of light between the surface grating coupler, and the lens along an optical path having at least one fold. The invention also covers the fabrication method of such a photonic chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.