Electronic device
US10209736B2 · kind B2 · utility
1Cited by
0References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2016 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Aug 31, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/1626
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are various embodiments related to a bonding member that bonds components of an electronic device. An electronic device may include a tape member that include: a first bonding layer and a second bonding layer. One of the first bonding layer and the second bonding layer comprises a material having a bonding force in a selected range in a predetermined temperature range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.